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| Craft level |
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NO.
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Items
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Process Capability
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1
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Layers |
1 to 60 layers |
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2
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Board Thickness |
4-315mil(0.1mm – 8mm) |
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3
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Max. Board Size |
864 x 610 mm (34" x 24") |
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4
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Accepted Base Material |
FR-4, CEM-1,CEM-3, High Tg, High CTI, Halogen Free. |
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5
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Board Thickness Tolerance |
≤1.0mm ±0.10mm (±4mil) 1.0~1.6mm ±0.15mm（6mil） |
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6
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Min. Inner Layer Line Width/Space |
4mil (0.10mm) |
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7
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Min. Inner Layer Thickness |
4/4mil (0.1mm) |
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8
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Min. Outer Layer Line Width/Space |
4/4mil(0.1mm) |
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9
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Layers Alignment Tolerance |
± 2mil (± 0.05mm ) |
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10
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Copper Foil Thickness |
12u,18u, 35u, 70 u, 105u, 140u, 175u, 210u (1/3oz-6oz) |
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11
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Min. Finished Hole Size |
0.15mm (6mil) HDI 0.1mm(4mil) |
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12
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Min. Drill Hole Size |
0.20mm HDI 0.1mm(4mil) |
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13
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Max. Drill Hole Size |
6.30mm |
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14
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Finished Hole Size Tolerance (PTH) |
± 0.076mm (±3mil) |
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15
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Finished Hole Size Tolerance ((NPTH) |
± 0.050mm (±2mil) |
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16
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Hole Location Precision |
± 0.076mm (±3mil) |
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17
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Hole Wall Cu Thickness |
18-25um (0.7-1.0mil) |
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18
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Max. Board Thickness Hole Size % |
13:1 |
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19
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Twist & Warp |
0.75% |
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20
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Min. SMT PAD |
0.4±0.05mm (16±2mil) |
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21
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Min. Solder Mask Clearance |
0.05mm (2mil) |
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22
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Min. Solder Mask |
0.05mm (2mil) |
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23
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Min. Solder Mask Bridge |
0.1mm (4mil) |
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24
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Surface Processing Type
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HAL&Lead-free HAL，Ni&Au Plating，Immension Silver，Immension tin，Immension Au，OSP. |
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25
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Gold Finger Thickness |
0.76um max (30u“ max) |
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26
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Immersion Au Thickness |
Ni: 2.54-6um / Au: 0.05-0.15um (100-238U" / 2-6U") |
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27
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Immersion Silver Thickness |
8-12U" (0.20um-0.30um) |
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28
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Immersion Tin Thickness |
0.8-1.2um (31.5-48U") |
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29
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OSP Film Thickness |
ENTEK PLUS HT:0.3-0.5um ; F2:0.15-0.3um |
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30
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V-Cut Angle |
30°、45°、60° |
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31
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Min. V-cut Thickness |
0.4mm |
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32
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Gold Finger Bevel Edge Angle |
20°、30°、45° |
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33
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Form |
Routing & Punching |
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34
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Form Tolerance |
± 0.10mm (4mil) |
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35
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E/T Voltage |
250 ± 5V |
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36
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E/T Max. Resistance of Nonconductor |
100 MΩ±10% |
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37
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E/T Min. Resistance |
10Ω |
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